Samsung is preparing to invest an additional $7.2 billion in its chip manufacturing operations in the United States, according to reports ahead of the South Korea–US summit scheduled for August 25. The funds are expected to go toward building an advanced chip packaging facility, expanding on the company’s existing $37 billion commitment to semiconductor production in the country.
Plans to Include 2nm and 4nm Chips
The new facility will support the production of 2nm and 4nm chips to meet rising demand from clients such as Apple and Tesla. The move is also seen as a strategic measure to mitigate potential impacts from tariffs under the Trump administration.
Samsung’s latest plans revive an earlier proposal that was scaled back when global demand for its chips slowed. The company’s initial $44 billion investment blueprint had included the packaging facility, but it was shelved at the time.
Complete Chip Solution for US
Samsung aims to leverage its ability to provide a complete semiconductor solution in the US, encompassing chip manufacturing, packaging, and memory chip production. By contrast, rival TSMC focuses on manufacturing and packaging, while SK Hynix specializes in memory chips.
Progress on Taylor Fab 1
Samsung’s major US plant, Taylor Fab 1, is nearing completion and is expected to be finished by the end of this year. However, installation of manufacturing equipment is scheduled for 2026, marking the next step toward full-scale production.
Although the $7.2 billion investment has yet to be officially confirmed, industry sources expect the company to make a formal announcement during the upcoming summit.